Intel Atom-Dual Core Segera Hadir!
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Setelah penulis mencicipi asus eeepc 1000 HE, penulis kesengsem dengan performa yang ditawarkan pc mungil ini dengan harga 3,5 juta ditahun 2009. Cukup powerful untuk browsing, ketik-ketik dokumen dan mobile online, batrenya tahan hingga 5 jam non-stop full music ( kalu minum di cafe, udah diusir dah wifi ga mati-mati tuh laptop pake batre apa coba.wkeke )
Nah, kali ini saya akan membahas teknologi khususnya prosesor yang disematkan di eeepc tersebut. Prosesor tersebut single core namun cukup mumpuni, nah mungkin karena banyak peminatnya intel menelurkan kembali varian terbaru intel atom,ingin tahu? Cekidot man :
Beberapa waktu lalu, Intel dikabarkan tengah menyiapkan prosesor Dual-Core bagi chip Atom mereka. Kini kepastian rumor tersebut telah dikonfirmasi oleh Paul Otellini, CEO Intel.Dalam beberapa konferensi, Otellini memang telah membenarkan rumor tersebut. “Saya berpikir pertumbuhan bisnis netbook dari tahun ke tahun akan semakin signifikan. Hal baru yang akan datang pada chip Atom, adalah prosesor Dual-Core,” paparnya.
Ia pun menjelaskan bahwa prosesor Atom berotak ganda tersebut bakal hadir pada kuartal II tahun ini, seiring dengan musim liburan. “Saya rasa ini akan menjadi produk yang sangat atraktif,” tambahnya.Kekuatan prosesor berlipat dengan harga yang lebih murah, tentu akan menjadi daya tarik bagi konsumen untuk memperbarui netbook lama mereka. Ya, prosesor Atom terbaru ini memang dirumorkan hadir dengan harga yang lebih murah.
“Harga prosesor Intel baru bakal menurun sekitar 19% pada kuartal II nanti, dibanding tahun lalu,” tambah Otellini. Prosesor Atom Dual-core pun bakal memiliki memory controler serta grafis terintegerasi. Alhasil, netbook-netbook Atom masa depan bakal mampu memainkan video beresolusi 720p dengan lancar ( gila ).Jadi, konsumen yang ingin membeli netbook baru namun dengan teknologi mutakhir harap bersabar. Tunggu saja performa chip Atom baru yang bakal hadir sebentar lagi
Untuk informasi saya akan menampilkan overview singkat tentang intel atom single core dulu ( yang tersedia )
¹ Transistor size comparison based on Intel® architecture products in production at the time of product disclosure (March 2008). Intel® 45nm and 32nm products are manufactured on a lead-free process. Leadfree per EU RoHS Directive (2002/95/EC, Annex A). Some RoHS exemptions may apply to other components used in the product package.
² Applies to components containing flame retardants and PVC only. Halogens are below 900 PPM bromine, 900 PPM chlorine, and 1500 PPM combined bromine and chlorine.
³ Select Intel® Atom™ processor SKUs support Intel® Burst Performance Technology (Intel® BPT)
Intel® Hyper-Threading Technology (Intel® HT Technology) requires a device with an Intel® processor supporting Intel HT Technology and an Intel HT Technology-enabled platform controller hub, firmware, and operating system. Performance will vary depending on the specific hardware and software used.
No computer system can provide absolute security under all conditions. A highly versatile crypto security engine is integrated within Intel® platform controller hub MP20 which with appropriate software enhances platform security capabilities. May require additional third-party software. Certain functionality may not be offered by some ISVs or service providers. Certain functionality may not be available in all countries. Intel assumes no liability for lost or stolen data and/or systems or any other damages resulting thereof.
Intel® Smart Sound Technology requires a system with an appropriate Intel® platform controller hub and may require additional third-party software or CODECs and the necessary drivers installed. System sound quality will vary depending on actual implementation, controller, CODEC, drivers, and speakers.
| Processor Number | Cache | Clock Speed | Bus Speed | Number of Cores | Max TDP | Intel® Virtualization Technology◊ | Intel® 64◊ | Execute Disable Bit◊ |
|---|---|---|---|---|---|---|---|---|
| 45 nm | ||||||||
| Z560 | 512 KB L2 | 2.13 GHz | 533 MHz FSB | 1 | 2.5 W | ![]() |
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| Z550 | 512 KB L2 | 2 GHz | 533 MHz FSB | 1 | 2.4 W | ![]() |
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| Z540 | 512 KB L2 | 1.86 GHz | 533 MHz FSB | 1 | 2.4 W | ![]() |
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| Z530P | 512 KB L2 | 1.6 GHz | 533 MHz FSB | 1 | 2.2 W | ![]() |
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| Z530 | 512 KB L2 | 1.6 GHz | 533 MHz FSB | 1 | 2 W | ![]() |
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| Z520PT | 512 KB L2 | 1.33 GHz | 533 MHz FSB | 1 | 2.2 W | ![]() |
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| Z520 | 512 KB L2 | 1.33 GHz | 533 MHz FSB | 1 | 2 W | ![]() |
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| Z515 | 512 KB L2 | 1.2 GHz | 400 MHz FSB | 1 | 1.4 W | ![]() |
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| Z510PT | 512 KB L2 | 1.1 GHz | 400 MHz FSB | 1 | 2.2 W | ![]() |
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| Z510P | 512 KB L2 | 1.1 GHz | 400 MHz FSB | 1 | 2.2 W | ![]() |
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| Z510 | 512 KB L2 | 1.1 GHz | 400 MHz FSB | 1 | 2 W | ![]() |
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| Z500 | 512 KB L2 | 800 MHz | 400 MHz FSB | 1 | 0.65 W | ![]() |
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| N550 | 1 MB L2 | 1.5 GHz | 2.5 GT/s DMI | 2 | 8.5 W | ![]() |
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| N475 | 512 KB L2 | 1.83 GHz | 2.5 GT/s DMI | 1 | 6.5 W | ![]() |
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| N470 | 512 KB L2 | 1.83 GHz | DMI | 1 | 6.5 W | ![]() |
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| N455 | 512 KB L2 | 1.66 GHz | 2.5 GT/s DMI | 1 | 6.5 W | ![]() |
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| N450 | 512 KB L2 | 1.66 GHz | DMI | 1 | 5.5 W | ![]() |
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| N280 | 512 KB L2 | 1.66 GHz | 667 MHz FSB | 1 | 2.5 W | ![]() |
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| N270 | 512 KB L2 | 1.6 GHz | 533 MHz FSB | 1 | 2.5 W | ![]() |
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| E680T | 512 KB L2 | 1.6 GHz | 2500 MHz PCIE | 1 | 3.9 W | ![]() |
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| E680 | 512 KB L2 | 1.6 GHz | 2500 MHz PCIE | 1 | 3.9 W | ![]() |
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| E660T | 512 KB L2 | 1.3 GHz | 2500 MHz PCIE | 1 | 3.6 W | ![]() |
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| E660 | 512 KB L2 | 1.3 GHz | 2500 MHz PCIE | 1 | 3.6 W | ![]() |
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| E640T | 512 KB L2 | 1 GHz | 2500 MHz PCIE | 1 | 3.6 W | ![]() |
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| E640 | 512 KB L2 | 1 GHz | 2500 MHz PCIE | 1 | 3.6 W | ![]() |
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| E620T | 512 KB L2 | 600 MHz | 2500 MHz PCIE | 1 | 2.7 W | ![]() |
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| E620 | 512 KB L2 | 600 MHz | 2500 MHz PCIE | 1 | 2.7 W | ![]() |
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| D525 | 1 MB L2 | 1.8 GHz | DMI | 2 | 13 W | ![]() |
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| D510 | 1 MB L2 | 1.66 GHz | DMI | 2 | 13 W | ![]() |
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| D425 | 512 KB L2 | 1.8 GHz | DMI | 1 | 10 W | ![]() |
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| D410 | 512 KB L2 | 1.66 GHz | DMI | 1 | 10 W | ![]() |
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| 45nm | ||||||||
| E665C | 512 KB L2 | 1.3 GHz | 2.5 GT/s PCIE | 1 | 7 W | ![]() |
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| E665C | 512 KB L2 | 1.3 GHz | 2.5 GT/s PCIE | 1 | 7 W | ![]() |
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| E645CT | 512 KB L2 | 1 GHz | 2.5 GT/s PCIE | 1 | 7 W | ![]() |
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| E645C | 512 KB L2 | 1 GHz | 2.5 GT/s PCIE | 1 | 7 W | ![]() |
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| E625CT | 512 KB L2 | 600 MHz | 2.5 GT/s PCIE | 1 | 7 W | ![]() |
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| E625C | 512 KB L2 | 600 MHz | 2.5 GT/s PCIE | 1 | 7 W | ![]() |
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| Small form factor CPU package | The new lead-free¹, halogen-free² Micro-Flip Chip package is 60% smaller in netbooks (22×22 mm) than a notebook CPU (35×35 mm), saving system board real estate in a much thinner and smaller industrial design, enabling small netbook form factors. |
|---|---|
| Efficient integration | The new Intel® Atom™ processor integrates the graphics, display, and memory controller with the processor. This integration results in platform BOM savings, improved performance, and package area and power reduction. |
| Intel® Enhanced Deeper Sleep (C4/C4E) | Saves power by flushing cache data to system memory during periods of inactivity to reduce power consumption and enable longer battery life. |
| Enhanced Intel SpeedStep® Technology | Multiple voltage and frequency operating points provide optimal performance at the lowest power. This allows for better matching of performance to application demand. |
| Low thermal design power | Low thermal design power enables thinner, lighter, more compact and portable netbooks as it reduces the cooling requirements. |
| Enhanced data prefetcher and Enhanced Register Access Manager | Anticipates data the processor is likely to need and stores the information within the processor’s L2 cache, resulting in improved performance since the processor doesn’t have to wait as long for data. |
| Intel® Advanced Smart Cache | Cache and bus design for efficient data sharing, providing enhanced performance, responsiveness, and power savings. |
- +View entry level desktops-specific features and benefits
-
Small form factor CPU package The new lead free¹, halogen free² Micro-Flip Chip package is 70% smaller (22×22 mm) than a desktop CPU (37.5×37.5 mm), saving system board real estate in a much thinner and smaller industrial design, enabling small entry level desktop form factors. Efficient integration The new Intel® Atom™ processor integrates the graphics, display, and memory controller with the processor. This integration results in platform BOM savings, improved performance, and package area and power reduction. Low thermal design power Low thermal design power enables smaller, sleeker desktops due to the lower cooling requirements. Enhanced data prefetcher and Enhanced Register Access Manager Anticipates data the processor is likely to need and stores the information within the processor’s L2 cache, resulting in improved performance since the processor doesn’t have to wait as long for data. Intel® Advanced Smart Cache Cache and bus design for efficient data sharing, providing enhanced performance, responsiveness, and power savings. Integrated DX9* graphics core The Intel® Graphics Media Accelerator 3150 provides 3D graphics performance for a good visual computing experience. Intel® High Definition Audio 5.1 Integrated audio support enables quality home theater sound and delivers advanced features such as multiple audio streams and jack re-tasking. PCI Express* x1 interface Offers up to 3.5 times the bandwidth over traditional PCI architecture. Supports LPC serial interface, ExpressCard and mini-card, and delivers fast access to peripheral devices and networking.
- -View handheld and smartphone-specific features and benefits
-
Highly integrated application processor Combines the CPU core, video accelerators, graphics, display, and memory controller on a single die built on Intel 45nm¹,² Hi-k manufacturing process for better platform performance, lower thermals, and enables smaller form factor devices. Intel® Burst Performance Technology³ Enables the processor to deliver on-demand performance in small form factor devices without impacting thermal design power. Intel® Hyper-Threading TechnologyΔ Enables increased performance and system responsiveness e.g. faster webpage downloads and multi-tasking capabilities at low power. Deep Power Down Technology (C6) New low-power state that allows both the core and L2 cache to be powered down when the CPU is idle. The power to use less and do more—Intel’s unique power-saving features enable longer battery life so you can stay unplugged longer. Intel® Smart Power Technology and Intel® Smart Idle Technology Optimizes device’s platform power usage based on what you are doing, resulting in extended battery life. Intel® Smart & Secure TechnologyΣ Enables a complete hardware and software security architecture compliant with industry standards: AES, DES, 3DES, RSA, ECC, SHA-1/2, DRM, 1000 bits of OTP, and enables secure boot. Enables trust between applications and a secure operating system. Intel® Smart Sound Technology§ Supports voice processing and a wide range of audio CODECs which enables ultra-low power consumption and increased battery life in portable applications. Hardware accelerated 2D and 3D graphics The integrated Intel® Graphics Media Accelerator 600 provides new 3D graphics experiences for handhelds and smartphones with support for 3D games, 3D user interfaces, or Google Earth 3D*. Hardware accelerated HD video encode (720p) and decode (1080p) Integrated graphics core which enables you to watch or stream HD movies, videos, and TV on-the-go, and capture videos in HD. Full Web browser support Support for plug-ins, media formats, and runtimes that deliver a rich Web experience with faster downloads, rich graphics, and video with less Web page load errors resulting in improved user experience. Enhanced data prefetcher and Register Access Manager Anticipates data the processor is likely to need and loads it into cache, resulting in improved performance. Intel® Advanced Smart Cache Enables efficient data sharing with enhanced performance, responsiveness, and power savings.
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